INTEL PASS ON THREE-DIMENSIONAL TRANSISTORS MOBILE SOC-CHIPS
Intel has adopted a new strategy for the development of integrated circuits for mobile gadget: smart phones and tablet computers. It is this segment of consumer devices in recent years shows the most rapid pace of development, so that any chip maker wants to take a bite of it as possible to a larger piece. According to Intel, its new doctrine will give the company an additional impetus to the market with the launch of a more productive and cost-effective chip.
The new doctrine implies a mobile manufacturing integrated circuits using the technology of three-dimensional `` transistors. Such technology is already quite a long time and has been used successfully in the issuance of central processors for personal computers, and now Intel said the willingness to extend the field of application of this technology.
What does the mobile SoC-chip migration to three-dimensional transistor? First, it means moving with the release of the 32-nm chips like `system-on-a-chip #39;to release 22-nm SoC-chips. Second, increased capacity of semiconductor devices - from 22% to 65% - by reducing power consumption.
The latter factor is particularly important for mobile electronics, as it means more autonomy than before gadgets.
This all sounds very good, but the interesting question as to the timing of new 22-nm SoC-chip. According voiced reports, the first ready-made device will go off the assembly line in the second half of 2013. Unfortunately, more officials Intel has not told, but even a small market analysis can provide information on the cost of chips.
Microchips family of Intel Atom are sold for as low as $ 42, and competing firms produce goods of the same class even cheaper. Intel is unlikely to be able to successfully play the market with a price tag well above the level of $ 40 for the cheapest scheme. But the advanced process technology and competitive advantages will establish a decent price - too aggressive pricing and significant discounts are unlikely to be needed.